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© 2021 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. Microvia Reliability we have your solutions for Selection of palladium activator technologies for coverage on a wide range of applications. M-Activate and M-Activator AP Colloidal Ionic Via Dep 4550 Electroless Copper Low stress, high throwing power electroless copper that provides excellent target pad wedge fill. Yield-boosting low etch technology that improves copper etch budgets in mSAP. Blackhole LE / Eclipse LE Shadow + MacuSpec VF-TH 300 Optimized metallization for complete epitaxial grain growth at key interfaces. Visit us at IPC APEX 2021 San Diego, CA | Jan 25-27 | Booth 2121