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44 PCB007 MAGAZINE I JANUARY 2022 trace thickness per layer required by traditional PCB fabrication processes. e digital 3D nature of the AME technology enables vias in any angle and with curved approaches between the layers the vias connect; this enables higher packing density and circuit speeds. Since dig- ital 3D fabrication enables a build of such cir- cuits in the 3D space, one could even consider the elimination of the term "layers" in an elec- tronic circuit. Michael Schleicher: From my perspective, this is one of the major advantages to creating indi- vidual 3D-shapes of (small) electronic systems to use maximal volume of the available "3D construction space." Usually, PCB design has lateral traces and vertical vias (holes). Both were manufactured in different processes. Additively manufactured electronics are not limited to lateral and vertical constructions; "any angle" connections could be used, and it is still manufactured within one machine. Johnson: In your paper, Michael, you define a dPCB as a digital printed circuit board. Are there multiple methods to create a dPCB? Can you elaborate? Schleicher: I greatly appreciate the pioneering work done by Nano Dimension and the suc- cess it has achieved for the industry. From my point of view, the entire industry is looking for ways to use digital printing. In the area of construction of metal, plastic, and ceramic components, intensive research is being carried out into possible applications for digital printing. In addition to the inkjet pro- cess, there are other promising processes that are still more or less in the research stage. ere are publications and reports from IDTechEx and Yole. e online AME Acad- emy from Nano Dimension has further exam- ples of digitally printed circuit boards already presented. Some additional investigations in electronics are presented in the field of MID (molded interconnect devices 1 ), and research is being conducted into methods of produc- ing circuits and circuit carriers using various printing principles. e current state of devel- opment is presented annually at the MID Con- gress (Germany). Similarly, there is a great deal of interest in new manufacturing methods for electronic cir- cuit carriers in the Organic and Printed Elec- tronics Association 2 . Here, too, the state of the art is presented at the annual LOPEC congress and trade show (Germany). From my point of view, this shows how dig- ital printing technologies are being used and further developed for the manufacture of a wide range of applications. What will be devel- oped in future times? is is still open, but the trend is clear and unambiguous. e 3D electronics working group of the FED e.V. (Fachverband Elektronik Design) is in exchange to MID e.V. and oe-a. Johnson: e structures formed by AME are quite different from those of a traditional PCB. Would you elaborate? Nulman: e digital nature of AME fabrication that includes 3D structures enables the forma- tion of connecting devices with wires only, no Jaim Nulman