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PCB007-Feb2022

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58 PCB007 MAGAZINE I FEBRUARY 2022 My Tech Talk #4 was about SAP technolo- gies. I also introduced the IC strategies of het- erogeneous integration. But even Karl Dietz's Tech Talk column wrote about advanced board technologies for IC interconnections many times from 2000 to 2010. 1,2 Introduction e expansion of IC functionality usually progresses with the shrinking of IC geom- etries, called "Moore's Law" aer Gordon Moore who first coined the phrase. But now that geometries are below 5 nm, the costs and difficulties are creating a barrier to much fur- ther advances. So, the solution seems to be to mix IC die on the same substrate as a system- in-package (SiP) that is now called heteroge- neous integration (HI). Heterogeneous Integration e constant reduc- tion in semiconductor transistor geometries has created a situation that appears less costly to break up very large-com- plex dies into smaller dies and combine them with modular dies, now named chiplets, and tiny Advanced Boards for Heterogeneous Integration discretes on an organic substrate using these exceedingly small trace and spaces along with very tiny vias. ree architectures have become the most likely candidates to accomplish this task (Figure 1): • Multiple IC die on a package substrate using a PCB, glass, or ceramic material • Silicon or glass interposer between the die and package • A small, embedded silicon bridge in the package substrate that connects the various die and discretes Happy's Tech Talk #5 by Happy Holden, I-CONNECT007 Figure 1: Vision of heterogenous integration packaging options favor these three architectures. (Source: ASM NEXX 3 )

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