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FEBRUARY 2022 I PCB007 MAGAZINE 63 • Costs: Labor intensive back-end processes will need to be minimalized or eliminated (this has caused other N.A. IC substrate fabs to close) • Assembly: Currently, there are no high- volume OSAT semiconductor assemblers in N.A.; these will have to be established • Customer support: Customer consulting, modeling, and engineering interfaces will need to be added • Test: Testing HI substrates will be specialized and needed tooling will have to be established • Co-design: It will have to be determined if the HI substrate fabricator will need to be capable of EDA design and modeling similar to today's IC packaging and OSAT vendors e complete list of challenges can be seen in Table 3. Conclusion e search for packaging solutions for the emerging heterogeneous integration sys- tems has just begun. Its foundations will be the FCBGA, silicon interposer, and 2.5D packaging solutions in use today, but with more emphasis on lower cost, higher perfor- mance, and geographic availability. Figure 8 shows the Intel concept of their EMIB and Table 3: Challenges for implementation.