PCB007 Magazine

PCB007-Feb2022

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76 PCB007 MAGAZINE I FEBRUARY 2022 phone" in 1993, that Japan jumped on HDI for mobile phone boards. e risk reduction process as seen in Figure 3 is an impor tant aspect in the roll- out of innovative technologies. Re-design Report At HP, a mobile phone customer came to us for advice on their new phone board, as we had over 20 years' experience miniaturizing the hand-held calculator. eir board was unique; it was seven layers with unbalanced construc- tion and three sub-component plated-through- hole boards laminated by an autoclave. I wrote a design report where our first proposal was to use controlled-depth blind vias by drilling and annealing to reduce the warpage. But the second proposal was to employ our new laser- Figure 2: The rewards do not balance the risks unless the risks are removed. Figure 3: A general model of system intervention strategy. (Source: 24 Essential Skills for Engineers)

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