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Racing ahead with Atotechs solution
for high reliability lead frame packages
The need for high-reliability lead frame packages, especially for automotive applications, is increasing.
Key factors are moisture sensitivity and heat resistance, which makes an improved and secure adhesion
between mold and metal necessary. Atotech's non-etching adhesion promotors for silver and nickel-
palladium-gold lead frames assure a tight chemical connection that is formed between mold and metal.
They also ensure a sealed package that withstands longer exposures to heat and humidity, thus im
-
proving overall package reliability. In comparison to similar products, our adhesion promotors for lead
f
rames
offer an exceptionally high degree of reliability and cost-efficiency and are non-etching as well
as non-roughening.
