Issue link: https://iconnect007.uberflip.com/i/1454922
178 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE situation. is will eventually lead to the "lights out" capabilities in the low-volume/high-mix electronics manufacturing industry. • "Additive Manufacturing and Multiphysics Analysis for Single- and Two-Phase Cooling," by Paul Bratt, ACI Technologies, Inc. ermal management must advance with the military's requirements for increased per- formance, lower costs, and rapid technology changes. Combining multiphysics analysis and additive manufacturing optimizes the cost, weight, and performance objectives using validated models and advanced fabrication techniques. ermal solutions that meet the complex requirements of the military must be incorporated early in the design process to preemptively address challenges using a sys- tem-level approach. is paper compares the benefits of single- phase and two-phase cooling in high-power applications. Novel additively manufactured designs were examined and experimentally tested to validate the multiphysics models. Best practice guidance will be shared. S13/FF4 Session "Artificial Intelligence and Machine Learn- ing: Using Machine Learning for Anomaly Pat- tern Recognition in Manufacturing Processes," by Shadi Kuo, Northrop Grumman Corp. As the manufacturing sector is under con- stant pressure to satisfy customers' demands in a competitive market by applying com- plex processes to meet manufacturing cost and schedule goals, the need to identify qual- ity variables within processes is occurring at a faster rate. Locating the source of process variations becomes more challenging for engi- neers. Each day, the manufacturing sector gen- erates tremendous amounts of data that pro- vide valuable information. is data is crucial to supporting strategic business operations Presenter: Dr. Marc Nikolussi, Head of Engineering Assembly and Interconnect Technology, Robert Bosch GmbH What is the most interesting question that your IPC APEX EXPO presentation answers? On an assembled PCB, there exist metal- lic particles which are larger than the minimum electrical clearance distance. Is this a risk for an electrical short? Can these particles be fully elimi- nated by cleaning techniques? What is your answer to that question, and why? Also, with cleaning techniques, these particles cannot be fully eliminated. The risk for electrical short has to be eval- uated by the proposed risk assessment tool. What is the most important piece of advice that you have for your audience? Providing evidence and transparency about the study on cleaning tech- niques. We show a strategy regarding risk assess- ment for such products in the automotive industry. IPC APEX EXPO: Conference Speakers Speak Out The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies: Why Foreign Object Debris on Electronic Assemblies is Not Bringing the Modern World to a Halt