Issue link: https://iconnect007.uberflip.com/i/1454922
76 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE you really miss out on an awful lot. You miss not just contributing but interacting with other people and meeting people. We've always talked about the networking that's so impor- tant at IPC, just getting to know other people that you can call up anytime you want. Christian: at's true. And you can't really say this to bosses, but I would say probably for me, the number one reason for me going to APEX and attending task groups and committee meetings is to meet my friends. Goldman: Which happen to be your colleagues in business and in the industry. And of course, those are the people you want to talk to. Because you're right, they talk the same lan- guage. Christian: Exactly. Goldman: Now, part of this honor of the fellow- ship award is a scholarship to the university or college of your choice. Have you picked one yet? Christian: Yes. But it wasn't an easy choice. I had four different institutions in mind—two where I attended and two that I worked at before I went into industry. And so, it was somewhat of a difficult choice, but I decided to give it to the chemistry department of the Univer- sity of New Brunswick. at's the province of New Brunswick, Canada, not the city of New Brunswick, New Jersey. Goldman: Of course! Over the years though, do you have any special memories, thoughts, or notable times in your committee work? Christian: Yes, several. I did a little homework before our meeting today and came up with a list of about a dozen; I don't think you want to hear them all. Goldman: Well, how about a couple? Christian: I guess the first, most significant one was working with the Electrochemical Migra- tion Task Group and syncing the IPC method with the Bellcore method for doing that test- ing. at is probably my first highlight of my times on the committees. And as we've already mentioned, I've been deeply involved in the solderability task groups, both for components and boards. I was on the committee for A-610. I did that for probably over a decade until I couldn't stand it anymore. It just got to be too much, and I had to leave that one. I've also been on committees for fluxes and solder paste. Another highlight was as an active member of TechNet. And with my TechNet pals, I started and we craed a test method for underfills that made it into the underfill document. I'm quite proud of that. I was also an original member of the 1601, 1602 PCB Handling and Storage task group where I've been active ever since. I rewrote two chapters of the Assembly and Joining Handbook. And then the last one I'll mention, I was the chair of the Con- ductivity Anodic Filament Task Group where Karl Sauder did most of the major liing by writing the handbook for that technique. I and others sort of helped him sharpen it though, editorially speaking. Like I said, he did most of the work. ose are some of my highlights. You miss not just contributing but interacting with other people and meeting people.