Issue link: https://iconnect007.uberflip.com/i/1454922
REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE I I-CONNECT007 125 Presenter: HongWen Zhang, Manager of Alloy Group, Indium What is the most interesting question that your IPC APEX EXPO presentation answers? The need for a low-mid-tem- perature solder, addressing the drop- shock-critical application without loss in TCT reli- ability. What is your answer to that question, and why? Durafuse LT and the second-gen pastes, reflowing as low as 190°C peak temperature, provide excel- lent drop-shock performance (at least comparable to SAC305 and two orders of magnitude superior to BiSn+) and the comparable TCT (-40/125°C) to SAC305. What is the most important piece of advice that have for your audience? For any applications of drop-shock-critical and low-mid-temperature-flow required, Durafuse LT will be the exclusive solder solution. It can be used for step-soldering following SAC soldering or directly for mainboard soldering to replace SAC305 pastes with reflow profiles of wide range of peak tempera- ture from 190°C to 245°C. IPC APEX EXPO: Conference Speakers Speak Out Lead-Free Low-Temperature Solder Paste for Drop Shock-Critical Applications Jessie Vaughan: An Emerging Engineer in Practice Jesse Vaughan, Technical Sales Engineer and year three participant in the IPC Emerging Engineer program, shares with Nolan Johnson how this experience has accelerated his career path.