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Design007-Mar2022

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MARCH 2022 I DESIGN007 MAGAZINE 73 in order to see how those things might impact 5G communication. Only by integrating the domains together can we start to address system design chal- lenges. Digital models, from components to systems, are required to connect the domains and enable early design optimization and veri- fication, realizing the dream of a zero-spin design process. DESIGN007 David Wiens is Xpedition product manager for Siemens Digital Industries Software. To read past columns or contact Wiens, click here. of-systems. e goal is to go up the chain as far as possible. e power of using digital twins across mul- tiple domains could look like this example. You start with a board-level signal integrity simula- tion that gives some idea of the EMI radiating from that board. en you use those results as part of modeling at the subsystem level, where you consider connectors and cablings and such things as the impact of a source harness against a victim harness, or the ability of the enclosure to contain radiation. en you integrate more elements into that verified subsystem digital model to determine behaviors at the system level, where you're modeling things like the car, the antenna, and the placement of a motor Choosing the right material for your application can be a major challenge. There are "cost to perfor- mance" decisions that need to be made in order to select material that will meet the expected perfor- mance requirements and the desired cost targets. Selecting a material that meets cost targets, but fails to perform in prototype development testing, results in costly revision spins, increases cost, and results in delays to market. From the resin type, the styles and types of glass fabrics, and various types of copper foils, the reader can have a clearer picture of what to know when selecting which material is most desirable for their upcoming products. This book does not provide answers to all things laminate, but the hope is to provide a solid base for making material selection decisions and, along the way, answer some key questions like these: • Why is PPO resin better than epoxy resin for electrical performance? • Why could flat glass fabrics reduce the skew and ease for laser drilling? • Why is very low-profile copper foil preferred for high-speed applications? • What is the impact of raw material on data rate or on signal integrity testing? W h e n d e s i g n s require high voltage CAF performance, thermal robustness, or high-speed mas- sive data transmis- sion rates, laminate materials must be s e l e c t e d t o s u i t your requirements for printed circuit boards. The compo- nents used to make the laminates must be studied to know the influence on these kinds of applications. This book was generated by key technical resources at Isola Group. Each of the contributing technical experts have 25–35 years of industry experience in laminate raw materials, laminate and prepreg manufacturing, laminate material develop- ment, new product introduction, PCB fabrication, and OEM applications. These individuals have con- tributed many years of tacit knowledge and experi- ence, which are the basis for this book. Download this book today! BOOK EXCERPT Introduction to The Printed Circuit Designer's Guide to... High Performance Materials

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