Design007 Magazine

A-SAP ™ Averatek semi-additive process offers a 90% reduction in size and weight over current state-of-the-art with 15 micron (.6 mm) trace and space Smaller is better. More info on A-SAP™ www.averatek.com 19mm 6mm Typical capability in the USA today: 75 microns A-SAP™: 25 microns and below A-SAP ™ allows use of much smaller packages A-SAP ™ enables ultra-high electronics density

• Design007 Magazine — March 2022
• Feature Contents — Planning Your Design Education Strategy
• Additional Contents
• Flex007 Contents
• Column — Plan Your Continuing PCB Design Education
• Feature Interview — Planning Your Design Education Strategy
• Short — Affinitiv Launches Electric Vehicle Division, Voltage
• Column — The Coupling Coup
• Feature Interview — Take Charge of Your PCB Design Education
• PCB007 Highlights
• Feature Interview — Planning Your Design Education: Keep an Open Mind
• Feature Interview — Setting Goals for Your PCB Design Education
• Short — All Systems Go! Ensuring Power Integrity: Explore, Design, and Verify
• Column — Gremlin Avoidance Tactics to Improve Productivity
• Article — Does Copper Pour on a Signal Layer Decrease Signal-to-signal Isolation?
• Column — Six Key Considerations for Designers New to PCB Layout
• Article — DFM 101: Edge Plating
• MilAero007 Highlights
• Column — What Can Manufacturers Expect From Bio-based Conformal Coatings?
• Column — Leveraging Model-based Engineering to Manage Risk, Part 2
• Short — Book Excerpt: Introduction to The Printed Circuit Designer's Guide to…High Performance Materials
• Flex007 Column — Flexible Circuits or Flexible Electronics?
• Flex007 Short — LG Bolsters Leadership in 5G Vehicle Connectivity
• Flex007 Highlights
• Flex007 Article — Flexible Hybrid Electronics Design: Reducing Time to Market
• Top Ten Editor's Picks
• Career Opportunities section
• I-007e Educational Resource Center
• Advertiser Index and Masthead