PCB007 Magazine


Issue link: http://iconnect007.uberflip.com/i/1460418

Contents of this Issue


Page 39 of 117

40 PCB007 MAGAZINE I MARCH 2022 depicts the serialized layout of the fabricated PCB structures. Each serialized coupon featured transmis- sion line segments terminated on one end (for the RF patches) and both ends (for single- ended microstrips) with ground-signal-ground (GSG) pads so that coplanar RF-probes with a 200 µm pitch could be used to perform high frequency S-parameter measurements up to 103 GHz. e test structures are as follows: Four sets of 5 mm, 15 mm and 30 mm long microstrips oriented at 0°, 3°, 7°, and 10° Two sets each of antenna patches oriented at 0°, 3°, 7°, and 10° fed by 5 mm and 10 mm microstrip lines Measurement Results and Summary Antennas routed on the IT-88GMW mate- rial showed ~0.17 standard deviation from tar- get resonance frequency. e magnitude of the resonance showed optimal reflection coef- ficient (max -36.3 dB) in all rotated positions (note: minimum required gain is -10 dB for an efficient patch antenna). Compared to data- sheet values (~3.0 Dk), IT-88GMW showed 1.34% change in Dk reflecting the degree rota- tions across the panel. e data obtained from this investigation shows that this is an optimal copper-clad laminate mater ial engineered for W-band frequency antenna designs. PCB007 Acknowledgements • INAOE (National Institute of Astrophysics, Optics and Electronics) • E/E Department - Reydezel Torres-Torres, INAOE • Edgar Colín-Beltrán, Conacyt-INAOE • Maria Serrano-Serrano, INAOE References 1. "Stack-up and routing optimization by under- standing micro-scale PCB effects," by G. Romo, C. Nwachukwu, R. Torres-Torres, S.-W. Baek, M. Schauer, DesignCon 2011. Chudy Nwachukwu is technical director, OEM marketing and design for SI, ITEQ. Presenters: Clothilde Manzano, Ph.D., Marketing Development Manager Ahlstrom-Munksjö Sébastien Esnault, Product Engineer, Atlantec, Group ACB What is the most interesting question that your IPC APEX EXPO presentation answers? How can we improve the environmental footprint of PCB producers when considering only consumables? In this way, could we replace the standard plastic film used as release sheet during PCB lamination by a more sustainable and cost-effective release sheet? What is your answer to that question, and why? Re- place the traditional plastic release films by a new generation of release sheets: the release parch- ments. The release parchment, OptiLayup, is made of 100% cellulose, is biodegradable and composta- ble. Last but not least, it is cost efficient and has shown very good performance for IPC Class 3 PCB production. What is the most important piece of advice that you have for your audience? See beyond and do not be stuck to your first impression. Innovation is a journey and even a tiny step is useful for every stakeholder! IPC APEX EXPO: Conference Speakers Speak Out Qualification Protocols for a Sustainable and Innovative Release Aid Within the PCB and CCL Laminating Press Process

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Mar2022