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54 PCB007 MAGAZINE I MARCH 2022 Feature Article by John Strubbe TAIWAN UNION TECHNOLOGY CORPORATION Taiwan Union Technology Corporation (TUC) provides copper-clad laminates and dielectric resin composites used to manufac- ture printed circuit boards. e enthalpy of these resin composites meets and exceeds cus- tomers' objectives and shows the deterioration of the resin's physical properties as a result of multiple lamination cycles (up to 10X). is article describes how TUC evaluates the possi- ble change in resin structure due to multi-ther- mal laminations. Polymer Degradation Based on Stress-Strain Curve e curve describes the method of mea- suring polymer degradation using tan δ (tan delta)—ratio of G" to G'. With regard to mate- rial compounds of synthetic macromolecules, the degradation is evaluated by measuring the resin composite interfaces and adhesion, and how they collectively play a role in determin- ing the properties of the polymers during pro- cessing. e strength of polymer-polymer interface between polymers depends on the structure that develops during its formation. e accumulating cycles on these resin com- posites can be analyzed by applying the princi- ples of the stress-strain curve, a graphical rep- resentation of the relationship between stress (derived from measuring the load applied on the sample), and strain (derived from measur- ing the deformation of the sample). e stress-strain curve provides design engi- neers with a long list of important parameters needed for application design. It is obtained by gradually applying load to the sample and mea- suring the deformation. ese curves reveal many properties of a material, such as the Young's Measuring Multiple Lamination Reliability for Low-loss Materials

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