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PCB007-Mar2022

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60 PCB007 MAGAZINE I MARCH 2022 ELISE Low-code Engineering Platform Joins the Altair Partner Alliance E Altair, a global leader in computational engi- neering and intelligence, announced that ELISE GmbH has joined the Altair Partner Alliance. is agreement makes ELISE's low- code engineering platform available via the APA and accessible via Altair's patented licens- ing system. European Semiconductor Market Hits Record High in 2021 E e European Semiconductor Industry Asso- ciation reported that yearly semiconductor sales in the European market reached US$ 47.757 billion in 2021, a 27.3% increase ver- sus 2020 and a 27% increase versus the same month in 2020. Keysight Unveils Self-Service Enterprise Agreement Licensing Portal E Keysight Technologies, Inc., a leading tech- nology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, unveiled a new self-service Enterprise Agree- ment Licensing portal. SEMI: Worldwide Silicon Wafer Shipments, Revenue Set New Records in 2021 E Worldwide silicon wafer area shipments in 2021 increased 14% while wafer revenue rose 13% compared to 2020, topping $12 billion, to reach new all-time highs, the SEMI Silicon Manufacturers Group reported in its year-end analysis of the silicon wafer industry. Intel, Partners Open Applications for New AI Labs at Community Colleges E Intel, Dell Technologies, and the American Association of Community Colleges (AACC) are announcing the AI Incubator Network, a new initiative from Intel's AI for Workforce program that will design and build artificial intelligence (AI) labs across the country by utilizing the expertise and industry connec- tions of America's community college system. Smart Manufacturing Spend Climbs Over $950B in 2030 E e COVID-19 pandemic quickened the pace of digital transformation, placing technolo- gies at the very center of how people live and work—and that pace shows no signs of slow- ing down. Cadence EDA Solutions, IP Optimized for Intel Process and Packaging Technologies E Cadence Design Systems, Inc. announced it has joined the new Intel Foundry Services (IFS) Ecosystem Alliance to support mutual customers with the development and delivery of innovative system-on-chip (SoC) designs. Dark Fiber Gift Enables a Major Expansion of the COSMOS Beyond-5G Testbed E e COSMOS beyond-5G testbed now being deployed in West Harlem is one of four wire- less networks recently created across the country for U.S. researchers to test new ways of boosting wireless internet speeds to support data-intensive applications in robotics, immer- sive virtual reality, and traffic safety.

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