PCB007 Magazine

PCB007-Mar2022

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98 PCB007 MAGAZINE I MARCH 2022 The photoimaging process is one of the first steps in the PCB fabrication process. In order to ensure that the image of the circuitry conforms as close to the desired design as possible (i.e., lines and spaces), surface preparation of the copper foil surface is one of the most critical success factors. Employing the optimum mix of surface cleaners and microetchants will provide a clean surface with sufficient surface area to promote dry film adhesion. John W. Mitchell, president and CEO of IPC, shares his thoughts with Barry Matties about the return of the in-person IPC APEX EXPO after a two-year hiatus. Hint: He was very positive about it. Pete Starkey interviews Mark Goodwin, COO of Ventec International, on the impact of the current supply chain condition. Their conversation also covers aerospace and the U.S. market. Real Time with... IPC APEX EXPO: Update From PCBAA PCBAA Chairman Travis Kelly sits down with Nolan Johnson to discuss the new association's recent activities and future plans. The Printed Circuit Board Association of America is focused on advocating for manufacturing in America. Trouble in Your Tank: Surface Preparation—The Foundation of the Photoresist Imaging Process Real Time with... IPC APEX EXPO: John Mitchell Shares Thoughts on the Show Real Time with… IPC APEX EXPO 2022: The Supply Chain and Markets TOP TEN EDITOR'S PICKS

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