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®
EX-S2, scan the QR Code to the right.
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NovaBond
®
EX-S2 –
The best of both worlds ahead
For a long time, attaining pristine signal integrity was only possible by sacrificing adhesion performance.
Fortunately, times have changed because now, the IC substrate market can look forward to something
new on the product horizon: NovaBond
®
EX-S2 from Atotech. As a nano-roughening adhesion promoter
for IC substrates, it combines chemical adhesion with mechanical anchoring and all without any measur-
able impact on the signal integrity, line width, or shape. The optimal combination of these high-end tech-
nologies assures outstanding adhesion and thermal reliability. As our most innovative adhesion promot-
er to date, it is suitable for ultra-fine-line applications down to 1 µm L/S, works regardless of copper type,
and is compatible with various high-speed substrate materials.
