PCB007 Magazine

PCB007-Mar2022

Issue link: https://iconnect007.uberflip.com/i/1460418

Contents of this Issue

Navigation

Page 45 of 117

46 PCB007 MAGAZINE I MARCH 2022 this standardized-optimized array procedure to the old array method. A good example of this is shown in Figure 5. e 12-layer HDI board (3+6+3) was ordered by the customer in the array of 3-up. By using a production panel of 8-up or 12-up, even with the additional material of the carrier and labor, the cost of this HDI board was reduced by $7 per board. PCB007 References 1. Better Board Buying Blog, by Greg Papandrew, Oct. 21, 2021. Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard, NanYa Westwood, Merix, Foxconn, and Gentex. He is currently a contributing tech- nical editor with I-Connect007, and the author of Automation and Advanced Procedures in PCB Fabrication, and 24 Essential Skills for Engineers. To contact Holden or read past columns, click here. Figure 5: Example of an HDI 12-layer (3+6+3) placed in a simple FR-4 carrier to save wasted material on the production panel.

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Mar2022