Design007 Magazine

Design007-Apr2022

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60 DESIGN007 MAGAZINE I APRIL 2022 Feature Interview by the I-Connect007 Editorial Team Editor's note: e following is an excerpt om our interview with Calumet's Todd Brassard and Meredith LaBeau originally published in the February issue of PCB007 Magazine. Calumet Electronics has been a domestic pioneer in manufacturing with additive and semi-additive electronics manufacturing pro- cesses. We recently asked Calumet's Todd Brassard and Meredith LaBeau to discuss the state of this technology, which traditional pro- cesses that they might replace, and some of the challenges facing OEMs or PCB shops that are considering these options. Meredith LaBeau: Because semi-additive and additive technologies are relatively new fields in the United States, young engineers have an opportunity to get in on the ground floor so to speak. is is an inroad for young engi- neers. With respect to a new market of products enabled by semi-additive processes, we are see- ing that U.S. designers lack experience design- ing at the smaller scales. Designers who are exploring additive manufacturing are doing so on their most complex designs, which makes sense, but it means the additive technology is being piled on top of an already messy build. It will take some time before board design- ers take full advantage of ground-up additive design. What I'm really seeing with the semi-addi- tive process is that designers don't know how to design for it. ey can't take their heads out of what they originally did and say, "I'm going Calumet on Additive and Semi-Additive Design

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