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JUNE 2022 I DESIGN007 MAGAZINE 51 your design efficiency over time by building up a knowledge base of the processes involved in circuit board fabrication and assembly. Coor- dinating with fabricators and assemblers may seem overwhelming and time consuming at first but give it some time. As you become familiar with the nuances of fabrication and assembly you will find yourself becoming more independent as you instinctively inte- grate their feedback into your daily workflow. In the long term, coordination will, in fact, reduce your workload and open more time for you to spend on other tasks. If you don't know who exactly will be fab- ricating and assembling your design, try to gather a list of potential partners. You could then work with those partners to pool their different requirements and capabilities. Once this data is gathered and combined, you can choose the most stringent requirements for each different category. is approach allows you to design a circuit board that will meet all potential partners' requirements, thus avoid- ing delays. If your circumstance does not allow you to compile a list of potential manufactur- ing and assembly partners, start somewhere by collaborating with the partners of your choice and go from there. Design with manufacturing goes above and beyond design for manufacturing by integrat- ing all key stakeholders on a project into a collaborative team. When using DWM, each document of the design package is reviewed by a relative team member who is an expert in the relevant field throughout the design pro- cess. Integrating modernized team approaches to your team workflow can help make DWM more efficient than ever. If successfully apply- ing DWM sounds overwhelming or seems unlikely to you, give it a try by starting small. ere is a good chance it will improve data package uptake. DESIGN007 Kyle Burk, PhD., is director of engineering at KBJ Engineering. by Bill Hargin Introduction: Mechanical vs. Electrical Worlds Another book about stackups? If you're asking this question, I'd like to know the book you're thinking of, as I was looking for it a few years back. I have a pretty good PCB sig- nal integrity (SI) library, and I've only found one chapter on stackup design so far. Whenever I talk in person with SI con- sultants—people who do SI consulting for a living—I ask them "of the smoke-jumping projects you've been brought in for where there were serious S I p r o b l e m s , h o w many of those proj- ects have stackup issues?" So far, the only answer I've got- ten back is, "100 percent." The difference between a high-speed PCB design that can be built, and a design that should be built, depends upon the backbone of the design itself: the stackup. The stackup touches every single high-speed signal and yet has had surprisingly little written about it. In my work, quite a number of PCB stackups cross my desk, and depending on who or what tools were involved in a given design, there are manufacturing parameters that affect both impedance and signal loss that design teams can improve upon. This book is by no means the last word on the subject, but rather a place to kick off a broader discussion about stackup planning and material selection, to reach the understanding of what I call "the design within the design." Download this book today! BOOK EXCERPT The Printed Circuit Designer's Guide to... Stackups— The Design within the Design

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