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Design007-June2022

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94 DESIGN007 MAGAZINE I JUNE 2022 The worst part of the global COVID pandemic brought unpredictability and uncertainty to an otherwise stable PCB Industry. Like many in the board business, Sunstone faced increasing demand from essential businesses while also dealing with inconsistent employee availability and social distancing guidelines that slowed the manufacturing process. Advances in tech- nology have been clear within the component packag- ing industry, as the ball grid array (BGA) package sizes reduce from 1.0 mm pitch to 0.8 mm, 0.4 mm, and even beyond. Currently, the high-density interconnect (HDI) method typically used for the breakout of such parts has been to create the smallest possible subtractive-etched traces with microvias to allow for connections and escapes on the inner layers of your PCB. Over the past several years there has been a steady increase in millimeter-wave (mmWave) applica- tions. As those applications increased, most aspects of the electronics industry, including the PCB industry, were forced into a steep learning curve. TOP TEN Connect the Dots: Leaning into Lean Manufacturing Designing PCBs With Additive Traces Designing Additive and Semi-Additive PCBs With components getting smaller and electronic devices becoming more compact, we are reaching the physical limits of the typical etched fabrication processes. To address these limits, new additive and semi-additive processes are being developed to fit into the current fabricators' production lines without too much disruption or extra cost. EDITOR'S PICKS Lightning Speed Laminates: The Importance of Circuit Features for mmWave Applications

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