PCB007 Magazine

PCB007-June2022

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26 PCB007 MAGAZINE I JUNE 2022 Plating is the deposition of a metal layer on a substrate to modify its properties. It occurs when the metal ion in an aqueous solution is reduced to the metal: M + metal ion + e - reducing electron g M 0 deposited metal Plating can achieve numerous functional and aesthetic goals, including: • Improve solderability • Inhibit corrosion • Increase hardness/durability • Decorate objects (jewelry) • Reduce friction • Alter conductivity • Improve IR reflectivity • Provide radiation shielding e reducing electron e - can be supplied from these deposition reactions: • Electroplating • Electroless plating • Immersion plating Electroplating is is a galvanic reaction that occurs when current is applied to an anode and a cathode immersed in the metal electrolyte. e anode is composed of the desired metal for depo- sition, typically copper, tin, or nickel. When voltage or current is applied, the metal at the anode will dissolve as a positive ion, leaving a negative charge at the anode. At the cathode, the positive ion will be reduced to the metal, taking up electrons from Plating in Electronic Applications The Plating Forum Feature Column by George Milad, UYEMURA

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