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54 SMT007 MAGAZINE I JULY 2022 Strengthening Domestic Chip Research, Design, Manufacturing E e Semiconductor Industry Association con- vened a productive roundtable discussion between Sen. Mark Warner (D-Va.)—one of the senators tasked with negotiating the U.S. jobs and competitiveness package—and more than a dozen senior executives from SIA mem- ber companies. Worldwide Semiconductor Market Expected to Increase 16.3% in 2022 E e European Semiconductor Industry Associ- ation reports on the release of the new semicon- ductor market forecast generated in May 2022 by the World Semiconductor Trade Statistics. New IPC Initiative Focuses on E-mobility Quality & Reliability E From battery fires to non-functional charging stations, from dendrites to poor cable connec- tions, electronic system failures have caused massive recalls. Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI2800 E Hitachi High-Tech Corporation announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufactur- er's metrology capabilities. Flexible Patch Detects Real-time Changes in Water Temperature E Researchers at Tokyo Tech invented a flexi- ble patch containing carbon nanotubes and stretchable conductors that can fit inside a pipe to detect real-time changes in water tempera- ture or the presence of contaminants. SEMICON West 2022 Hybrid to Spotlight Sustainability, Smart Technologies, Talent E Sustainability, smart technologies, and work- force development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco. SEMI Foundation Awarded $1.5M Grant to Bolster Michigan's Semiconductor Industry Talent Pipeline E SEMI and Michigan Governor Gretchen Whit- mer announced with the Michigan Economic Development Corporation that the SEMI Foundation has been awarded $1.5 million in funding to design and develop the SEMI Career and Apprenticeship Network in Michigan. Qualcomm Unveils Next Generation Powerline Communication Device E Qualcomm Technologies is working with vir- tually all global, leading automakers and their supply base in support of the Combined Charg- ing Systems international standard for charg- ing electric vehicles. Cadence Design IP Portfolio in TSMC's N5 Process Gains Broad Adoption Among Lead- ing Semiconductor, System Companies E Cadence Design Systems, Inc. announced a wide range of leading semiconductor and sys- tem customers have successfully adopted the comprehensive line-up of Cadence® Design IP in TSMC's 5nm process technology.

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