54 SMT007 MAGAZINE I JULY 2022
Strengthening Domestic Chip Research,
Design, Manufacturing E
e Semiconductor Industry Association con-
vened a productive roundtable discussion
between Sen. Mark Warner (D-Va.)—one of
the senators tasked with negotiating the U.S.
jobs and competitiveness package—and more
than a dozen senior executives from SIA mem-
ber companies.
Worldwide Semiconductor Market
Expected to Increase 16.3% in 2022 E
e European Semiconductor Industry Associ-
ation reports on the release of the new semicon-
ductor market forecast generated in May 2022
by the World Semiconductor Trade Statistics.
New IPC Initiative Focuses on E-mobility
Quality & Reliability E
From battery fires to non-functional charging
stations, from dendrites to poor cable connec-
tions, electronic system failures have caused
massive recalls.
Hitachi High-Tech Launches Dark Field
Wafer Defect Inspection System DI2800 E
Hitachi High-Tech Corporation announced
the launch of the Hitachi Dark Field Wafer
Defect Inspection System DI2800, a critical
component in any semiconductor manufactur-
er's metrology capabilities.
Flexible Patch Detects Real-time
Changes in Water Temperature E
Researchers at Tokyo Tech invented a flexi-
ble patch containing carbon nanotubes and
stretchable conductors that can fit inside a pipe
to detect real-time changes in water tempera-
ture or the presence of contaminants.
SEMICON West 2022 Hybrid
to Spotlight Sustainability,
Smart Technologies, Talent E
Sustainability, smart technologies, and work-
force development will take center stage at
SEMICON West 2022 Hybrid, July 12-14 at the
Moscone Center in San Francisco.
SEMI Foundation Awarded $1.5M Grant
to Bolster Michigan's Semiconductor
Industry Talent Pipeline E
SEMI and Michigan Governor Gretchen Whit-
mer announced with the Michigan Economic
Development Corporation that the SEMI
Foundation has been awarded $1.5 million in
funding to design and develop the SEMI Career
and Apprenticeship Network in Michigan.
Qualcomm Unveils Next Generation
Powerline Communication Device E
Qualcomm Technologies is working with vir-
tually all global, leading automakers and their
supply base in support of the Combined Charg-
ing Systems international standard for charg-
ing electric vehicles.
Cadence Design IP Portfolio in TSMC's N5
Process Gains Broad Adoption Among Lead-
ing Semiconductor, System Companies E
Cadence Design Systems, Inc. announced a
wide range of leading semiconductor and sys-
tem customers have successfully adopted the
comprehensive line-up of Cadence® Design IP
in TSMC's 5nm process technology.
