PCB007 Magazine

PCB007-Aug2022

Issue link: http://iconnect007.uberflip.com/i/1476200

Contents of this Issue

Navigation

Page 50 of 97

IPC ADVANCED PACKAGING SYMPOSIUM: Building the IC-Substrate and Package Assembly Ecosystem EXPERIENCE AND LEARN: • 28 speakers, eight sessions, and three keynotes focus on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe • Identify key challenges to overcome to enable sustainable businesses over the long run • Focus on 'punching through' into actionable research, development, design, materials, manufacturing, and business operations execution needs • Actionable next steps and an expanded network for continued development efforts October 11-12, 2022 Kimpton Hotel Monaco Washington, D.C. ipc.org/event/advanced-packaging-symposium

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Aug2022