PCB007 Magazine

PCB007-Aug2022

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96 PCB007 MAGAZINE I AUGUST 2022 Our library is open 24/7/365. Visit us at: I-007eBooks.com Stackups: The Design within the Design by Bill Hargin, Z-zero Finally, a book about stackups! From material selection and understanding laminate data- sheets, to impedance planning, glass weave skew and rigid-flex materials, topic expert Bill Hargin has written a unique book on PCB stackups. Get yours now! High Performance Materials by Michael Gay, Isola This book provides the reader with a clearer picture of what to know when selecting which material is most desirable for their upcoming products and a solid base for making material selection decisions. Get your copy now! NEW! Thermal Management with Insulated Metal Substrates, Vol. 2 by Didier Mauve and Robert Art, Ventec International Group This book covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. Add this essential book to your library. The Systems Designer's Guide to... System Analysis by Brad Griffin, Cadence In this book, the author, Brad Griffin of Cadence, focuses on EM and thermal analysis in the context of data center electronics systems. Be sure to also download the companion guide for end-to-end solutions to today's design challenges. The Electronics Industry's Guide to... The Evolving PCB NPI Process by Mark Laing and Jeremy Schitter, Siemens Digital Industries Software The authors of this book take a look at how market changes in the past 15 years, coupled with the current slowdown of production and delivery of materials and components, has affected the process for new product introduction (NPI) in the global marketplace. As a result, companies may need to adapt and take a new direction to navigate and thrive in an uncertain and rapidly evolving future. Learn how to streamline the NPI process and better manage the supply chain.

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