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Design007-Sep2022

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SEPTEMBER 2022 I DESIGN007 MAGAZINE 63 cess. Following your fabricator's DFM guide- lines is the first place to start. DESIGN007 References 1. Per IPC-4556 Nominal pad size of 0.060" x 0.060" (1.5 mm x 1.5 mm). 2. Per IPC-4553A Nominal pad size of 0.060" x 0.060" (1.5 mm x 1.5 mm). Anaya Vardya is president and CEO of American Standard Circuits; co-author of The Printed Circuit Designer's Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals; and author of Thermal Management: A Fabricator's Perspec- tive. Visit I-007eBooks.com to download these and other educational titles. He also co-authored "Funda- mentals of Printed Circuit Board Technologies" and provides a discussion of flex and rigid flex PCBs at RealTime with… American Standard Circuits. soldering applications. is surface finish will yield a dull tarnished looking surface. ere is significant industry data showing that the dullness does not affect solderability or reli- ability. ImmAg is inexpensive. It is typically used for flat surface/fine pitch devices and is aluminum wire bondable. ImmAg has good RF performance if the fol- lowing guidelines are followed: • Packaging and storage are critical • Careful handling required • High insertion friction—not well suited for press fit pins Understanding the cost drivers in PCB fab- rication and early engagement between the designer and the fabricator are crucial ele- ments that lead to cost-effective design suc- The four largest semiconductor acquisition agree- ments in 1H22 accounted for essentially all of the $20.6 billion in M&A value during the first half of this year, according to M&A data contained in IC Insights' August 3Q Update of The McClean Report service. Topping the M&A deals in 1H22 was an agreement by a Chinese investment consortium to take over bankrupt semiconductor conglomerate, Tsinghua Unigroup. In April 2022, government-backed Beijing Jianguang Asset Management Co. (JAC Capital) led a group of investment firms to complete a $9.4 bil- lion injection of payments into Tsinghua Unigroup, which runs Yangtze Memory Technologies. The second largest chip acquisition agreement in 1H22 was Intel's $5.4 billion deal to buy wafer foundry Tower Semiconductor in Israel. The cash purchase, announced in February 2022, is expected to be completed by early 2023 and is part of Intel's push into the silicon foundry business. In May 2022, California-based MaxLinear announced an agreement to buy Silicon Motion in Taiwan for $3.8 billion in cash and stock. This acqui- sition is expected to be completed in 1H23 and will add controller ICs for NAND flash storage to MaxLin- ear's lineup of RF and mixed-signal products. AMD, in April 2022, announced a $1.9 billion agreement to buy packet-processor and cloud-com- puting software startup Pensando Systems in Milpi- tas, California, to boost its presence in the data cen- ter market and increase competition with Intel. The acquisition of Pensando was finished in May 2022, three months after AMD completed its purchase of Xilinx in February 2022. (Source: IC Insights) Four Large Agreements Prop Up 2022 Semiconductor M&A Total

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