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Design007-Oct2022

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40 DESIGN007 MAGAZINE I OCTOBER 2022 Will Marsh: CHIPS Act Update E Nolan Johnson reconnects with PCBAA Presi- dent Will Marsh, who brings him up to speed on the initial stages of implementation and administration, and provides more insight on the Supporting American Printed Circuit Boards Act of 2022. A Deeper Look at the CHIPS Act Investment E In this interview with Chris Peters at U.S. Partnership for Assured Electronics (USPAE), Nolan Johnson seeks for better understand- ing regarding the implications of funding the CHIPS Act. Frankly, where and how will the $52 billion be spent? Who will decide how the funds are allocated? North American PCB Industry Sales Up 15.1% in August E IPC announced the August 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. e book-to-bill ratio stands at 0.98. IPC APEX EXPO 2023 Offers New Courses, New Instructors, and IPC E-Textiles E Registration is now open for IPC APEX EXPO 2023, to be held at the San Diego Convention Center in San Diego, Calif., Jan. 21–26, 2023. Boeing Invests $5M in Advanced Manufacturing Innovation Center E Boeing announced it is investing $5 million to help expand the Advanced Manufacturing Innovation Center in St. Louis. e invest- ment will help fund a state-of-the-art advanced manufacturing facility and grow the region's talent pipeline and technical and manufactur- ing abilities. Electronics Industry Calls for U.S. Presidential Determination on Key Components Under Defense Production Act E e electronics industry is calling on U.S. Pres- ident Joe Biden to address urgent industrial base vulnerabilities and deliver on the prom- ise of the CHIPS Act by prioritizing domes- tic development of printed circuit boards and integrated circuit substrates under Title III of the Defense Production Act. Designing Through Supply Chain Pain E Engineers are accustomed to the demanding challenges of designing for miniaturization, cost reduction, cross platform compatibility, and harsh environments. What has proven to be the most painful experience of my career (and for many of my colleagues) is the sheer lack of components from which to build our designs. CAES Wins Contracts for Development of Next-Generation, Octa-Core, User-Selectable CPU for Space E CAES, a leader in advanced mission-criti- cal electronics for aerospace and defence, announced that it has won multiple contracts with the European Space Agency (ESA) for the development of the GR765 System- on-Chip (SOC), the first user selectable CPU for space.

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