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OCTOBER 2022 I DESIGN007 MAGAZINE 95 We've seen many changes over the past few years, and nowhere are they more evident than in the world of sourcing components. Sourcing has become one of the biggest challenges facing PCB design- ers and design engineers today. In this month's column, two of Electrolube's leading resin specialists have collabo- rated to give you the clearest focus of how introducing bio-based resins systems will impact your production process and the benefits they bring in terms of performance. Regarding basic principles of thermal dis- sipation there are three ways of dissipating energy: Conduction, convection, and radia- tion. The integrated metal substrate (IMS) printed circuit boards rely predominantly on heat conduction all the way through the different layers of the substrates from a hot point (the base of the component) to a cold point (the furthest surface of the metal base) and, usually, thereafter, through a dissipator. Just as I tend to exhibit discomfort in oversized con- ference halls and meeting rooms, I self-diagnose as agoraphobic when it comes to entering PCB layouts full of wasted space. Mechanical constraints which utilize the printed circuit board substrate material as a mechanical or structural "filler" within an electronic product, under-utilizing the material for its intended purpose to support conductive circuitry, grate on me like nails on a chalkboard. For the second consecutive year, IPC is hosting an IPC Design Com- petition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2023. One of the most amaz- ing advances in PCB manufacturing tech- nology has been the advent and usage of laser direct imaging (LDI) technology. Though the LDI revolution began more than 20 years ago, there's still room for more PCB manufac- turers to invest in this powerful tool. For the latest news and information, visit Ventec Thermal Management Book Excerpt: Chapter 1 Sensible Design: Comparing Traditional and Bio-based Resins A New Sourcing Paradigm Connect the Dots: Examining the Benefits of Laser Direct Imaging Target Condition: Practical Packaging Density in PCB Design PCB Designers to Vie for Design Champion Title at IPC APEX EXPO 2023

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