PCB007 Magazine

PCB007-Oct2022

Issue link: https://iconnect007.uberflip.com/i/1481876

Contents of this Issue

Navigation

Page 5 of 103

6 PCB007 MAGAZINE I OCTOBER 2022 SHORTS New Nanowire Assembly Process Could Enable More Powerful ICs Nanusens Granted First Patent with More in the Pipeline Researchers Develop Novel Spectrum Sensing Technique for 6G IoT Comms Infographic: Anatomy of DMD Imaging Book Excerpt: The Printed Circuit Designer's Guide to... High Performance Materials, Chapter 4 DEPARTMENTS Career Opportunities Educational Resources Advertiser Index & Masthead COLUMNS The CHIPS Act is Just the Beginning by Travis Kelly Surface Finish Evolution From Conventional to Advanced by George Milad Retaining Engineers in the Workplace by Hannah Nelson Success in Photolithography Starts With Surface Preparation by Michael Carano Leadership 101: The Law of Explosive Growth by Steve Williams Closing the Innovation Gap by Christopher Bonsell Induction Junction, What's Your Function? by Todd Kolmodin INTERVIEW Direct Factory Suite: Custom Made with Stefan Stefanescu HIGHLIGHTS MilAero007 Top Ten from PCB007 28 44 50 66 76 80 84 58 56 88 30 34 48 79 87 91 102 103 OCTOBER 2022 • ADDITIONAL CONTENT 28 44

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Oct2022