SMT007 Magazine

SMT007-Nov2022

Issue link: http://iconnect007.uberflip.com/i/1483130

Contents of this Issue

Navigation

Page 47 of 95

48 SMT007 MAGAZINE I NOVEMBER 2022 unique dual-launch configuration was again suc- cessful on this mission," said Ryan Reid, presi- dent of Boeing Satellite Systems International. Copper Foil Market Worth U$17.32B by 2030 at 10.31% CAGR E According to a Comprehensive Research Report by Market Research Future (MRFR), "Copper Foil Market Information by Prod- uct, Form, Category, Distribution Channel, and Region–Forecast till 2030," the market is estimated to grow at a 10.31% CAGR to reach USD 17,321.8 million by 2030. Collins Aerospace Receives Milestone Certification for Combined Vision Systems E Collins Aerospace has achieved a technical standard order for its combined vision system for business aviation aircra. Dr. Hans-Peter Tranitz Appointed Senior Director, Solutions at IPC Electronics Europe GmbH E IPC announces the first employee of its new legal entity in Germany, Hans-Peter Tranitz, Ph.D. Dr. Tranitz will serve as senior director, Solutions, at IPC Electronics Europe GmbH in Munich. Taiwan Union Technology Corporation First Company Globally to Re-qualify Products to IPC-4101 E IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing to Tai- wan Union Technology Corporation, an elec- tronics materials manufacturing company head- quartered in Zhubei, Hsinchu County, Taiwan. IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs E ere is a significant capability gap in advanced substrate packaging in North America, forc- ing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. is was a common theme during a two- day IPC Advanced Packaging Symposium. Electronics Industry Calls for U.S. Presidential Determination on Key Components Under Defense Production Act E e electronics industry is calling on U.S. Pres- ident Joe Biden to address urgent industrial base vulnerabilities and deliver on the prom- ise of the CHIPS Act by prioritizing domes- tic development of printed circuit boards and integrated circuit substrates under Title III of the Defense Production Act. CAES Wins Contracts for Development of Next-Generation, Octa-Core, User-Selectable CPU for Space E CAES, a leader in advanced mission-criti- cal electronics for aerospace and defence, announced that it has won multiple contracts with the European Space Agency for the devel- opment of the GR765 System-on-Chip, the first user selectable CPU for space Boeing-Built SES Satellites Send, Receive First Signals E Two newly launched Boeing-built satellites are sending and receiving signals as they continue their journey to their orbital destinations. "Our

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Nov2022