Issue link: https://iconnect007.uberflip.com/i/1483130
NOVEMBER 2022 I SMT007 MAGAZINE 63 of representatives from Averatek, Calumet, GreenSource Fabr ication, Sanmina, and TTM. A recurring theme was the urgent need for in-region capabilities. Each speaker, in their own way, made the argument that the U.S. and EU need to ramp up these capabilities. Dur- ing her Q&A session, for example, Kim Eilert of BAE Systems was asked when BAE would need to have this capability available to them. Her answer was, "Today." It was clear that she meant that quite literally. Another common theme was that significant investment will be needed. For example, dur- ing one panel discussion, it was suggested that an advanced packaging facility will require two orders of magnitude more clean room area than a current traditional PCB fab, and that it will likely cost a minimum of 2X that of a traditional PCB fab to construct. is symposium succeeded in exposing the urgency and the magnitude of the need to sup- port advanced packaging in all regions of the globe. What needs to happen next is ongoing work to focus the efforts, educate manufac- turers and legislators, use government fund- ing wisely, and to look at this as an ongoing process for as much as 10 years. I-Connect007 attended the event and gath- ered a series of key interviews from the 26 pre- senters. e following five interviews aim to pro- vide you with a feel for what happened, what's important, and what's to come.