Design007 Magazine

Design007-Nov2022

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6 DESIGN007 MAGAZINE I NOVEMBER 2022 COLUMNS Leveraging Digital Automation to Accelerate PCB Design by Stephen V. Chavez Managing Solder for Fewer Heat Sink Failures by Matt Stevenson Encapsulation Resins: PU vs. Epoxy by Beth Massey What More Do We Need to Know? by Tim Haag ARTICLES & INTERVIEWS DFM 101—Final Finishes: ImmSn by Anaya Vardya Analyzing Gerry Partida's 'Significant' Microvia Reliability Paper by Happy Holden DownStream Flexes in Rigid-Flex with Joe Clark and Mark Gallant HIGHLIGHTS MilAero007 Flex007 Top Ten Editor's Picks SHORTS Thinnest Ferroelectric Material Ever Paves Way For Efficient Devices Does Physics Help with Electrical Engineering? Novel Carrier Doping in p-type Semiconductors New Tech Manages Two-Way Power Flow to Commercial Buildings Infographic: Maxwell vs. Moore IDTechEx Reports on Five Key Trends for Tomorrow's Electric Car BOOK EXCERPT: The Printed Circuit Designer's Guide to... Stackups: The Design within the Design DEPARTMENTS Career Opportunities Educational Resource Center Advertiser Index & Masthead 21 31 37 43 49 55 74 79 92 93 32 52 56 64 50 60 70 44 68 76 NOVEMBER 2022 • ADDITIONAL CONTENTS 32

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