Design007 Magazine

Maxwell vs Moore Moore's Law brought everyone into the SI arena of Maxwell's Laws! IC Technology trends from Moore's Law Separate PWR/GND Planes Narrowing Noise Margins (SI) Higher Bandwidth among Chips Higher Integration Faster Rise Times (SI) More Pins-Area Array Voltage Reduction Die Size Reduction (smaller ICs)=<$ More Complex BGAs (SI/PI) Higher Current Higher I/0

• Design007 Magazine — November 2022
• Feature Contents — A Fight to the Physics
• Additional Contents
• Column — It's All About the Physics—or Is It?
• Feature Interview — The Physics of PCB Design
• Feature Article — My Experience With Maxwell
• Short — Thinnest Ferroelectric Material Ever Paves Way For Efficient Devices
• Feature Column — Forget What You Were Taught
• Short — Does Physics Help with Electrical Engineering?
• Column — Leveraging Digital Automation to Accelerate PCB Design
• Short — Novel Carrier Doping in p-type Semiconductors
• Feature Column — Fitting Physics to fact
• Short — New Tech Manages Two-Way Power Flow to Commercial Buildings
• MilAero007 Highlights
• Feature Article — Physics, Electrical Engineering, and PCB Design
• Article — DFM 101—Final Finishes: ImmSn
• Column — Managing Solder for Fewer Heat Sink Failures
• Short — IDTechEx Reports on Five Key Trends for Tomorrow's Electric Car
• Column — Encapsulation Resins: PU vs. Epoxy
• Article — Analyzing Gerry Partida's 'Significant' Microvia Reliability Paper
• Column — What More Do We Need to Know?
• Flex007 Highlights
• Interview — DownStream Flexes in Rigid-Flex
• Short — Book Excerpt: The Printed Circuit Designer's Guide to… Stackups: The Design within the Design
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead
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