Issue link: https://iconnect007.uberflip.com/i/1484263
22 PCB007 MAGAZINE I NOVEMBER 2022 Jan Pedersen of NCAB Group is deeply involved in IPC standards development sur- rounding ultra HDI and keeps his finger on the pulse of the industry surrounding this type of fabrication. With Asia still dominating this area, Jan sees the need for U.S. and European PCB fabricators to make the investment if they want to stay competitive. Nolan Johnson: Jan, you're very involved in UHDI design and manufacturing. What's your perspective on these topics within the industry now, and where UHDI is going? Jan Pedersen: ere are seven to 10 factories globally that can produce what we call ultra HDI. e definition for UHDI is 50-micron and below track and gap. You can use subtractive The Growing Need for UHDI methods down to, let's say, 35 or 40 microns, and then when you creep down below that level you need mSAP or xSAP technologies. at has been around for many years. It's not really a new technology. It was introduced into the packaging or the component indus- try in the 1970s and '80s, but it was brought up again when Apple and others started to do smartphones. ere are those factories that are involved in this, but they are factored for one customer, so it's very hard for a smaller cus- tomer to get into UHDI, and most companies are smaller than Apple. If you are a bit smaller, you don't get access. It's simple as that. I've tried it myself, tried to place an order with a big European PCB group that claims they have the capability. But when you have your Gerbers and your data and you Feature Interview by the I-Connect007 Editorial Team