98 PCB007 MAGAZINE I NOVEMBER 2022
For the past two
years, EIPC's Tech-
nical Snapshot
series has kept us
extremely well-
informed on devel-
opments in printed
circuit materials and
manufacturing tech-
nologies. But what is currently happen-
ing in the global PCB market, and how is
Europe and the rest of the world affected
by the current world situation?
Success in the plating room rests largely on
the understanding of and the application of
those critical principles that govern the
process of electrodeposition. This month,
I look at the fundamentals of plating distribu-
tion and throwing power, and what that
means for the circuit board fabricator.
Computer science has become the new "cool." Today's students
were groomed to want jobs in tech at big companies with happy
hours, big paychecks, and high status. Let's face it, manufacturing
just isn't sexy. It's dirty, manual, and for electronics, has a history of
low margins. The pipeline into the field is broken. But it doesn't have
to stay that way. Paige Fiet lays out the problem behind the board.
IPC Symposium: U.S. Must Address Critical
Gaps in Advanced Packaging Needs
There is a significant capability gap in advanced substrate
packaging in North America, forcing all semiconductors to
be packaged in Asia and leaving North America at risk in
its supply chain.
Trouble in Your Tank: Electro-
deposition of Copper, Part 3—
Plating Distribution and Throwing
EIPC Technical Snapshot:
'Tremendous Uncertainty'
in Global PCB Marketplace
The New Chapter:
Let's Make Manufacturing 'Cool' Again
Pete Starkey
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