Issue link: https://iconnect007.uberflip.com/i/1487920
12 DESIGN007 MAGAZINE I DECEMBER 2022 so many designers reaching retire- ment age and not as many new designers following in their foot- steps. Because we are aware of this challenge, we are actively using our resources to improve the situ- ation. Shaughnessy: e IPC Design Competition returns this year. Will you be involved in that again? Moyer: Yes, I am one of the judges as well as involved in the conception of the design projects. I've seen the number of com- petitors and it looks to be really interesting. Shaughnessy: You teach a variety of design classes for IPC. What are the biggest challenges you see facing PCB designers today? Moyer: As the speeds of designs increase, there is an increase in the need for designers to understand and grasp many engineering con- cepts that were not previously part of the designer's skill set. ese include signal integrity, power integrity, material prop- erties, manufacturing processes pros and cons, assembly pro- cesses pros and cons, to name a few. Designs are only going to get more complex, and faster, and of course smaller. Shaughnessy: Is there anything else you'd like to add? Moyer: As a PCB designer who has been attend- ing IPC APEX EXPO for almost 20 years, I can say I would not have been as successful in my career had it not been for the networking and knowledge I gained there. Shaughnessy: anks for talking with me, Kris. Moyer: ank you, Andy. Kulicke and Soffa Industries has inked multiple purchase orders for its thermo-compression solu- tion and has also successfully shipped its first flux- less thermo-compression bonder (TCB) to a key customer. To mitigate the growing challenges and decreas- ing benefits of two-dimensional node shrink, the semiconductor industry is aggressively pursuing more complex assembly approaches such as het- erogeneous integration (HI) and system-in-package (SiP) for emerging logic, processor, mixed-signal, silicon photonics, and sensing applications. These new approaches are enabling more efficient, tran- sistor-dense packages with higher levels of perfor- mance. Innovations by K&S, including its fluxless thermo-compression process are essential to the future of semiconductor packaging. Through close engagements with industry- leading customers, the fluxless TCB approach is a market-ready solution for next-generation logic assembly. Kulicke & Soffa's novel fluxless process eliminates contamination concerns while ensuring interconnect integrity through a unique and inte- grated fluxless delivery module. Chan Pin Chong, K&S's executive vice president of products and solutions said, "TCB remains the most cost-effective micro-bump solution for the fine-pitch interconnect process. K&S's unique flux- less bonding brings strong product differentiation value for the Thermo-Compression process. With our extensive development efforts, innovations and engagements with several customers, we are well positioned to rapidly support the emerging industry needs for leading-edge logic production." In addition to fluxless thermo-compression, the company's semiconductor advanced packaging portfolio and development initiatives also address wafer-level packaging, SiP, high-accuracy flip chip, lithography and hybrid bonding applications. (Source: PRNewswire) Kulicke & Soffa Extends Advanced Packaging Leadership Kris Moyer