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What IPC is doing
to further the conversation
IPC has been actively working to educate policy-
makers on the importance of investing in the entire
semiconductor supply chain, including advanced
packaging and printed circuit boards, to achieve
the goals of the CHIPS Act. An IPC report last win-
ter found the U.S. has only just begun to invest in
advanced packaging, while nations in Asia have
the lion's share of capabilities and capacity. A more
recent report by IPC, based on a survey of nearly
100 industry leaders in semiconductors and related
fields, shows strong industry support for increased
public and private investments in advanced pack-
aging efforts.
The recently enacted CHIPS and Science Act
includes IPC-backed provisions to invest at least
$2.5 billion in advanced packaging capabilities in
the U.S. in 2023. An IPC-convened symposium on
the topic in Washington, D.C., was well attended
by representatives of the U.S. government and all
sectors of the electronics industry. We succeeded
in nominating several packaging experts to a new
USG advisory panel on microelectronics. IPC has
also submitted official comments on the issue to
the U.S. Department of Commerce and to the Euro-
pean Commission, both of which are planning major
investments in the semiconductor supply chain in
2023.
How IPC members
can get involved
No matter who you supported in the last election,
it's more important than ever to make sure they hear
you as the new Congress gets down to business. IPC
needs its members and friends to make their voices
heard, and the best place to start is pledging to stay
informed and engaged in IPC advocacy in 2023-24.
When you sign up, IPC will keep you informed about
the issues and send you timely opportunities to
contact your elected officials on
key issues.
Scan the QR code; it only
takes a few clicks and will add so
much to the industry's advocacy
effort.
