SMT007 Magazine

SMT007-Jan2023

Issue link: http://iconnect007.uberflip.com/i/1489269

Contents of this Issue

Navigation

Page 25 of 103

26 SMT007 MAGAZINE I JANUARY 2023 Advanced Packaging Beyond the Zetabyte Era Feature Article by Tom Rucker INTEL As the industry continues to aggressively pursue Moore's Law, the technology enve- lope and solution space has grown to include packaging. Historically, the role of the package was to protect the die from the environment and to scale the small geometries of the die to the significantly larger pitches of the system board. Moving forward, the package is also being used to interconnect multiple die in one unit. is facilitates assembling die from differ- ent technology nodes into overall smaller form factors with higher performance. e industry refers to this approach generally as "advanced packaging," or heterogeneous 3D integration. Across market segments, from computing to communications to defense, products that use advanced packaging technologies are becom- ing more prevalent. e importance of packaging technology is reflected in its prominent inclusion in the U.S. CHIPS and Science Act. e law estab- lishes the National Advanced Packaging Man- ufacturing Program (NAPMP), which seeks to "strengthen semiconductor advanced test, assembly, and packaging capability in the domestic ecosystem." ese provisions dem- onstrate that the importance of packaging tech- nologies has spread beyond the technology industry into the realm of policymaking. Pro- grams funded in the CHIPS Act ensure that the U.S. will continue to drive important advances in packaging technologies, supporting efforts to rebalance global chipmaking capability and capacity. is onshoring will both strengthen the overall supply chain and ensure the ful- fillment of critical domestic market require- Photo credit: John Harrington

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT007-Jan2023