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76 SMT007 MAGAZINE I JANUARY 2023 tion screened by DEI, including temperature cycling, burn-in and electrical tests. Finally, the leads and ePads were hot solder dipped to remove the native matte tin plating. Several of the screened parts were submitted for qualifi- cation testing. Figure 2 illustrates the qualifi- cation tests and flow. e reliability tests were performed with MSL 4 / 235 °C precondition- ing per the product requirement. DEI Project Results e OCPP packages were tested and quali- fied for production with results meeting the requirements of factory-fresh parts. e tables shown in Figure 3 provide further insight into the qualification testing process, conditions, and results. Parts were subjected to a range of compo- nent level environmental stress tests and con- ditions. Not only did the parts pass these tests, but also the end item equipment production and final assembly qualification tests. is case study illustrates the robustness of the OCPP solution and highlights its effectiveness in a mil-aero application. SMT007 Sam Sadri is a senior packaging engineer at QP Technologies. Figure 3: Qualification test summary for OCPP.