SMT007 Magazine

82 SMT007 MAGAZINE I JANUARY 2023 AI-assisted Software for Easier and Faster Programming Reliable and Approximation-free Volume Measurement of Paste Deposits for Highest SPI Efficiency Real-time Auto-control of 3D AOI Program Efficiency to Prevent False Calls and Escapes Flexible and Agile 3D AOI Technology to Ensure Consistent Performance Process Control Based on Inspection Data Analysis to Maintain Highest First-pass Yield Inline 3D SPI and 3D AOI are the most cost-effective ways to control and optimize process efficiency. To get the most from your investment, here are five things to consider: The Top Five Things You Need to Know About INSPECTION by Mycronic 1 2 3 4 5

• SMT007 Magazine — January 2023
• Featured Content — The Impact of Advanced Packaging
• Additional Content
• Column — Advanced Packaging
• Column — Creating a Better World Through Engineering
• Feature Interview — The Nuts and Bolts of Advanced Packaging
• Short — Novel Multi-Proton Carrier Complex as Efficient Proton Conductor at High Temperatures
• Feature Article — Advanced Packaging Beyond the Zetabyte Era
• Short — NIST Resources for CHIPS Act Participants
• Column — An Unblinkered View
• Feature Article — Key Findings From Semiconductor Fabrication Research
• Short — Shrinking Qubits for Quantum Computing With Atom-thin Materials
• MilAero007 Highlights
• Article — A CMMC 'Plan B'
• Feature Article — Integra: Redefining Die Prep in the U.S.
• Column — Fair and Square
• Feature Article — Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
• Special Section — The Top 5 Things You Need to Know About
• Top 5 Things: Blackfox Training
• Top 5 Things: Burkle North America
• Top 5 Things: Mycronic
• Top 5 Things: Taiyo America
• Top 5 Things: Technica, U.S.A.
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead
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