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4 DESIGN007 MAGAZINE I JANUARY 2023 FEATURE ARTICLES Advanced Packaging Means Advanced Routing Issues by Kris Moyer A Challenge Facing Aerospace Designers in 2023 by Lee Ritchey Scaling Beyond Silicon by Ashutosh Mauskar FEATURE COLUMNS PCB Design and Advanced Packaging by Andy Shaughnessy Threading the Needle Through Advanced Packaging by Tim Haag Advanced Packaging Not a Passing Fad by John Watson 10 24 54 8 28 32 JANUARY 2023 • FEATURE CONTENTS The year 2022 might be remembered as the Year of Advanced Packaging. The Department of Defense got the ball rolling last summer with the CHIPS Act, and the IPC Advanced Packaging Symposium helped outline the hurdles we're facing with complex packaging. In this issue a vari- ety of experts discuss the challenges and trade-offs that PCB designers and design engineers are seeing today with advanced packages. The Advanced Future 10 32 28 54

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