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8 DESIGN007 MAGAZINE I JANUARY 2023 It's hardly an exaggeration to say that 2022 might be remembered as the Year of Advanced Packaging. e Department of Defense got the ball rolling last summer with the CHIPS Act, which pointed out how far the United States has fallen behind the rest of the world in microelectronics. A few months later, the week-long IPC A d v a n c e d P a c k - aging Sympo sium took place in Wash- i n g t o n , D.C . , a n d I-Connect007 cov- ered this event from start to finish. Among the things we learned from the symposium: ere's a great deal of inno- vation taking place in advanced pack- a g i n g n o w, a n d i t a l l s t a r t s w i t h PCB designers and design engineers making the correct decisions early in the design cycle. When we started planning this issue, we wondered: What exactly do we mean by the term advanced packaging? IPC's Kris Moyer teaches a PCB design course on this topic, and he was kind enough to provide us with a two- pronged definition of advanced packaging: "e first definition is with respect to IC pack- ages. For this, advanced packaging refers to the interposer boards that are made with advanced specialty materials, typically non-FR-4, along with advanced special manufactur- ing techniques and methodologies. " T h e s e c o n d i s w i t h r e s p e c t t o s y s t e m / p r o d u c t d e s i g n . Fo r t h i s , advanced packag- ing is a description of any advanced tech- niques and method- ologies used in the design of PCBs for non-standard prod- ucts. ese include sequential lamination and microvias used in HDI/fine-pitch products, chip-on-board/chip- on-flex, direct wire-bond of bare silicon die to the board, non-standard board geometry, extreme reduction in board area, non-standard board mounting , etc." —Kris Moyer The Shaughnessy Report by Andy Shaughnessy, I-CONNECT007 PCB Design and Advanced Packaging

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