Issue link: https://iconnect007.uberflip.com/i/1490123
42 PCB007 MAGAZINE I JANUARY 2023 by different test requirements and capabili- ties needed for each subcomponent, in addi- tion to verifying that the complete, integrated units perform to specifications. A further chal- lenge with advanced packaging is determining the optimum locations in the process flow for the different testing steps, to balance costs and yield management, as well as the scalability of the test and measurement solutions themselves. e world is moving to zeta-scale comput- ing, driven by the exponential growth of data that needs to be collected, stored, and ana- lyzed. As this trend continues, advanced pack- aging becomes a requirement to meet the per- formance and dimensional requirements of these systems. Breakthrough technologies across design and manufacturing are needed to successfully deliver innovative products and capabilities. Innovation in computing products requires major advances in advanced packag- ing over the next few years, a development that promises to usher in a new and exciting era of opportunity for the industry. PCB007 Tom Rucker is vice president of technology development at Intel. Article by Nolan Johnson At the recent IPC Advanced Packaging Sympo- sium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semi- conductor and R&D sectors, and the CHIPS and Science Act. In Gayle's presentation, he said the vision for the CHIPS and Science Act (also known as the CHIPS Act) is to develop and preserve three key areas: economic security, national security, and future innovation. He emphasized that the CHIPS Act is about more than just the semiconductor chips, reserving an entire slide for that point alone. While NIST acknowl- edges that the U.S. holds an impressive 85% stake in the semiconductor design market, only 3% of the global packaging industry resides within the U.S. (Figure 1). In support of this mission, Gayle drew attention to a series of resources that are now available on NIST.gov: • Metrology and Standards "Strategic Opportunities for U.S. Semiconductor Manufacturing: Facilitating U.S. Leadership and Competitiveness through Advancements in Measurements and Standards," August 2022. • Stakeholder Input on CHIPS Act "Incentives, Infrastructure, and Research and Development Needs to Support a Strong Domestic Semiconductor Industry: Summary of Responses to Request for Information," August 2022. • Commerce Strategy for Implementation "A Strategy for the CHIPS for America Fund," September 2022. • Semiconductor Supply Chain RFI Findings "Results from Semiconductor Supply Chain Request for Information," January 2022. Gayle concluded that the Incentives Program application process will be announced in February 2023 with funding proposals considered on a rolling basis. Learn more about the CHIPS Act at nist.gov. References 1. Data courtesy of the U.S. Department of Defense and IPC. NIST Resources for CHIPS Act Participants Figure 1: The U.S. has a majority stake in semiconductor design but trails behind the rest of the world in both manufacturing and packaging 1 .