PCB007 Magazine

PCB007-Jan2023

Issue link: https://iconnect007.uberflip.com/i/1490123

Contents of this Issue

Navigation

Page 82 of 113

AVAILABLE IN AMBE R O U R B I G G E ST F L E X Y E T ! Excellent bendability High Resolution by photolithography High Reliability Simplified process UL94 VTM-0 certified Low spring back force Resolution Line/Space=50/50µm Solder mask defined opening (30µm diameter) AMBER Follow us on social media B Y T A I Y O Contact your local sales representative today! Visit www.taiyo-america.com for more information. B E N D I N G T H E P O S S I B I L I T I E S

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Jan2023