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REAL TIME WITH... IPC APEX EXPO 2023 SHOW & TELL MAGAZINE I I-CONNECT007 51 Eric Campbell "Root Cause Analysis and Risk Assessment of Multilayer Ceramic Capacitor Flexural Crack Propagating Fault," by Eric Camp- bell, IBM Corpora- tion. His co-authors are Jennifer Bennett, Jim Bielick, Mehdi Hamid, and Kevin O'Connell, all with IBM Corpora- tion. This paper was presented during Technical Conference Session S13: QRTI – Printed Board Reliability, on Wednesday, Jan. 25. Martin Leung "High-Resolution Physical Analyses of Microvia-Target Pad Interfaces," by Martin Leung, PhD, and Scott Sitzman, The Aerospace Corporation. Their co-authors are Eric Frasco, Zachary Lingley, PhD; Gary Stupian, PhD; James Parke; and Shawn Ashley, all with The Aerospace Corporation. This paper was presented during Technical Con- ference Session S11: HDI1 – Microvia Analysis and Modeling, on Tuesday, Jan. 24. Top Honors in the Best of Conference Category Read about this year's other award winners REAL TIME WITH... IPC APEX EXPO 2023 SHOW & TELL MAGAZINE I I-CONNECT007 51