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The gold standard for Anylayer
BMV filling
Inpulse
®
2HF9 – The smarter solu on for smartphone PCB anylayer BMV pla ng
The need for filled blind micro vias (BMVs) in smartphone printed circuit board applications is steadily
increasing. That is why MKS' Atotech developed Inpulse
®
2HF9 – an economical and high-performing
Superfilling
®
solution for BMVs, which needs 50% less plated copper than conventional processes
available in the market today. Inpulse
®
2HF9 assures the longest electrolyte lifetime, dimples with less
than 10 μm, fine line capability of less than 40 μm, excellent physical properties, and crystal structures,
all while providing complete analyzability and control of the plating chemistry through CVS.
To find out more about Inpulse
®
2HF9 , scan the QR-code to the right.
