FEBRUARY 2023 I PCB007 MAGAZINE 85
John Ekis, market segment director,
Aerospace and Defense, Rogers Corpo-
ration, discusses the importance of close
applications engineering relationships
in understanding and responding to the
requirements and challenges of specialist
new product development.
There is no better way to
end 2022 than by recog-
nizing the hardworking stu-
dents and educators who
are driven to invest their
time and energy in the elec-
tronics manufacturing indus-
try. Through the IPC Schol-
arship and Awards program,
we can help students in-
vest in their future and re-
ward the accomplishments
of those who have dedicat-
ed themselves to bettering
themselves and the industry.
IPC recently awarded a total
of $54,000 in scholarships
and awards.
Last year turned out to be a fairly slow year for
mergers and acquisitions (M&A) in the North
American PCB and EMS sectors. We counted
just seven completed or announced deals in the
PCB sector last year, compared to 13 in 2021,
nine in 2020, and eight in 2019. Firan Technolo-
gy Group announced two of 2022's seven deals
with a 2023 target for completion for both.
The main task of the final finish is to protect the copper pad
from tarnishing or oxidation while simultaneously keeping
the surface active for the assembly. Electroless nickel/im-
mersion gold (ENIG) is a widely accepted finish in the market
that provides a good solderability and capability for Al-wire
bonding. A main function of the gold layer is to prevent the
oxidation of the nickel layer.
Monday at IPC APEX EXPO 2023, IPC, in part-
nership with IPC Publishing Group, launched
an industry-specific quarterly publication (a
digital publication with a special print edition
for show participants), "IPC Community."
The publication celebrates member success
while sharing the important work being done
within the association to better serve its members and the
global electronics manufacturing community.
When you're new to your career, your role, or even new to the industry, the pressure can be im-
mense. Then you find yourself at a trade show representing your company, tasked with bringing
information back to your organization. But take heart, at least you're not Harrison "Jack" Schmitt.
Jack really understood pressure.
For the latest news and information, visit PCB007.com
Foundations of the
Future: IPCEF's
Scholarships,
Awards and Student
Opportunities
IPC Debuts First Issue of IPC Community at
IPC APEX EXPO 2023
Why Gold Layer Thickness in ENIG Matters
for Soldering
Nolan's Notes: The Trade Show Is Over—Now What Do You Do?
Real Time with... IPC APEX
EXPO 2023: Challenges of
New Product Development
Punching Out:
Here's the Deal About 2022
