SMT007 Magazine

SMT007-Apr2023

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52 SMT007 MAGAZINE I APRIL 2023 Hughes Circuits Earns IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements QML E IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronic Designer, Fabr icator and A ssembler, Requirements Qualified Manufacturers Listing (QML), to Hughes Circuits Inc., located in San Marcos, California. Insulectro and LCOA Install R&D Lab With Partner Kyocera in Orange County E Insulectro, the largest distributor of materials for use in the manufacture of printed circuit boards and printed electronics, has opened a testing and development laboratory for Kyocera tools in its Lake Forest, CA headquarters. The Lab was created in association with backup and entry materials manufacturer LCOA™ in that company's plant. Fresh PCB Concepts: PCBs for Harsh and Extreme Environments, Part 1 E At the end of 2022, NCAB's Ryan Miller completed IPC's six-week IPC training cer tification, PCB Design for Militar y, Aerospace and Other Extreme Environments. This in-depth course provided him with the knowledge and tools to provide support to customers who are designing within these harsh and/or extreme environments. IPC Issues February Economic Outlook Report: Economic Data Provides a Mixed View of the Economy E Economic data over the last month is provid- ing a mixed view of the economy per IPC's February Economic Outlook report. NextFlex Launches $4.4M Hybrid Electronics Funding Opportunity E N e x t F l e x , A m e r i c a 's F l e x i b l e H y b r i d Electronics (FHE) Manufacturing Institute, released Project Call 8.0 (PC 8.0), the latest call for proposals that seek to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing that support Department of Defense priorities. IPC Welcomes U.S. Presidential Determination Prioritizing Domestic Development of Printed Circuit Boards and IC Substrates E IPC, the global association representing the electronics manufacturing industry, welcomes the action of U.S. President Joe Biden in issuing a "presidential determination" that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA). American Made Advocacy: A Collective Stake in American Microelectronics E Recently, hundreds of thousands gathered in Las Vegas for the annual Consumer Electronics Show, where amazing new tech was rolled out—everything from razor-thin TVs to smart robots that clean your home. As an executive in the materials science space, I was struck not just by the pace of innovation, but also by the incredibly complex supply chains that were necessary to bring those products from the drawing board to reality.

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