Issue link: https://iconnect007.uberflip.com/i/1499197
info @ atotech.com www.atotech.com Gold plating solution – Universal, green, economical To find out more about Aurotech ® G-Bond 3, scan the QR-code to the right. Aurotech ® G-Bond 3 – Our new mixed reac on gold for ENIG, ENEPIG, and EPAG with non-toxic stabiliza on Reaching your sustainability goals while enjoying safer and more cost-effective PCB production is easier than ever with our new Aurotech ® G-Bond 3. As our latest generation gold electrolyte solution, it fulfils all industry standards for ENIG, ENEPIG, and EPAG plating. Among its many benefits is its non-toxic stabi- lization, meaning no handling of KCN replenishment is required. Its autocatalytic properties reduce the risk of a corrosive attack on nickel surfaces, thus fulfilling the latest industry regulations. Aurotech ® G-Bond 3 enables the deposit of a high gold layer thickness on nickel and palladium, with an excellent thickness dis- tribution of < 5% COV. This results in superior stability and a long bath life with no plate out operating at a low gold content of 0.6 g/l. Thanks to its reduced drag-out losses and low target thickness, our new gold electrolyte with autocatalytic properties offers real cost benefits during production for all types of gold containing final finishes.