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12 The PCB Design Magazine • February 2014 by yuriy Shlepnev SiMBeRiAn inC. summarY: dielectric and conductor roughness models are necessary for PCB and packaging inter- connect analysis up to 50 gHz and beyond. this article provides an overview of a variety of meth- ods for identifying these models. Meaningful interconnect design and com- pliance analysis must start with the identifi- cation of broadband dielectric and conductor roughness models. Such models are not avail- able from manufacturers and the model identi- fication is the most important element of suc- cessful interconnect design for link paths with 10–50 Gbps and higher data rates. Electromag- netic analysis of interconnects without such models may not be accurate. An overview of broadband dielectric and conductor roughness models for PCB and packaging interconnect problems is provided in the paper. Theory of model identification with generalized modal S- parameters and separation of dielectric and con- ductor dispersion and loss effects is described. Practical examples of successful dielectric and conductor roughness model identification up to 50 GHz are also provided. Introduction The largest part of interconnects can be for- mally defined and simulated as transmission line segments. Models for transmission lines are usually constructed with a static or electro- magnetic field solvers. Transmission lines with homogeneous dielectrics (striplines) can be ef- feature PCB and Packaging Design up to 50 GHz: Identifying Dielectric and Conductor Roughness Models

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